Development of integral passive components for multilayer organic MCMs at millimeter wave frequencies

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 1, 2002, Pages 98-101

  Pham, Anh Vu H ^a   Krishnamurthy, Vikram ^b,c   Bates, D ^d   Marcinkewicz, W ^e   Schmanski, B ^f   Saia, R ^b,c   Sprinceanu, L ^b,c  

^a AMRL   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^c GE GLOBAL RESEARCH   (United States)

^d Dielectric Laboratories   (United States)

^e ERICSSON RESEARCH   (Sweden)

^f BAE SYSTEMS   (United States)

Author keywords

Flex; Integral resistor; Millimeter wave; Organic multichip modules (MCMs); Tantalum Nitride (Ta2N); Wide band terminator

Indexed keywords

FREQUENCIES; MILLIMETER WAVES; MULTILAYERS; RESISTORS; SEMICONDUCTING POLYMERS; TANTALUM COMPOUNDS; THIN FILM DEVICES;

WIDE-BAND TERMINATORS;

MULTICHIP MODULES;

EID: 0036478944     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.1017691     Document Type: Conference Paper

References (8)

1. Thin film passive elements on polyimide film
2. Use of BCB in high frequency MCM interconnects
3. Multichip-on-flex plastic encapsulated MHDI-low cost substrateless manufacturing for microwave and millimeter wave modules
4. LRM probe-tip calibrations using nonideal standards
5. Ultra low loss millimeter wave multichip module interconnects