Reactive sputtering of TiOxNy coatings by the reactive gas pulsing process. Part I: Pattern and period of pulses

Surface and Coatings Technology

Volumn 201, Issue 18, 2007, Pages 7720-7726

  Martin, N ^a   Lintymer, J ^a   Gavoille, J ^a   Chappe J M ^c   Sthal, F ^b   Takadoum, J ^a   Vaz, F ^c   Rebouta, L ^c  

^a Centre National de la Recherche Scientifique   (France)

^b FEMTO ST INSTITUTE   (France)

^c UNIVERSITY OF MINHO   (Portugal)

Author keywords

period; Pulsing pattern; Reactive gas pulsing process (RGPP); Reactive sputtering; Titanium oxynitride

Indexed keywords

ARGON; FLOW RATE; MAGNETRON SPUTTERING; NITROGEN; PULSATILE FLOW; REACTIVE SPUTTERING; SPUTTER DEPOSITION; THIN FILMS; TITANIUM COMPOUNDS;

DC REACTIVE MAGNETRON SPUTTERING; REACTIVE GAS PULSING PROCESS; TITANIUM OXYNITRIDE;

INORGANIC COATINGS;

ARGON; FLOW RATE; INORGANIC COATINGS; MAGNETRON SPUTTERING; NITROGEN; PULSATILE FLOW; REACTIVE SPUTTERING; SPUTTER DEPOSITION; THIN FILMS; TITANIUM COMPOUNDS;

EID: 34249340143     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.03.002     Document Type: Article

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