-
1
-
-
0028485501
-
Power semiconductor devices for variable-frequency drives
-
Baliga B.J. Power semiconductor devices for variable-frequency drives. Proc. IEEE 82 (1994) 1112
-
(1994)
Proc. IEEE
, vol.82
, pp. 1112
-
-
Baliga, B.J.1
-
2
-
-
0030270893
-
Trends in power semiconductor devices
-
Baliga B.J. Trends in power semiconductor devices. IEEE Trans. Electron Devices 43 (1996) 1717
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, pp. 1717
-
-
Baliga, B.J.1
-
3
-
-
0032139423
-
Silicon carbide MEMS for harsh environments
-
Meheregany M., Zorman C.A., Rajan N., and Wu C.H. Silicon carbide MEMS for harsh environments. Proc. IEEE 86 8 (1998) 1594
-
(1998)
Proc. IEEE
, vol.86
, Issue.8
, pp. 1594
-
-
Meheregany, M.1
Zorman, C.A.2
Rajan, N.3
Wu, C.H.4
-
4
-
-
8744300169
-
Development of multilayer SiC surface micromachining process with capabilities and design rules comparable to conventional polysilicon surface micromachining
-
Song X., Rajgopal S., Melzak J.M., Zorman C.A., and Mehregany M. Development of multilayer SiC surface micromachining process with capabilities and design rules comparable to conventional polysilicon surface micromachining. Mater. Sci. Forum 389-393 (2002) 755
-
(2002)
Mater. Sci. Forum
, vol.389-393
, pp. 755
-
-
Song, X.1
Rajgopal, S.2
Melzak, J.M.3
Zorman, C.A.4
Mehregany, M.5
-
7
-
-
0035341462
-
Thermal sensor properties of cermet resistor films on silicon substrates
-
Sudden J.E., and Buchanan R.C. Thermal sensor properties of cermet resistor films on silicon substrates. Sens. Actuators A 90 (2001) 118
-
(2001)
Sens. Actuators A
, vol.90
, pp. 118
-
-
Sudden, J.E.1
Buchanan, R.C.2
-
8
-
-
33745445024
-
High temperature piezoresistive β-SiC-On-SOI pressure sensor with On-Chip SiC thermistor
-
Montpellier, France
-
Ziermann R., Berg J.V., Obermeier E., Niemann F., Moller H., Eickhoff M., and Krotz G. High temperature piezoresistive β-SiC-On-SOI pressure sensor with On-Chip SiC thermistor. Proceedings of the Conference of ECSCRM'98. Montpellier, France (1998) 229
-
(1998)
Proceedings of the Conference of ECSCRM'98
, pp. 229
-
-
Ziermann, R.1
Berg, J.V.2
Obermeier, E.3
Niemann, F.4
Moller, H.5
Eickhoff, M.6
Krotz, G.7
-
9
-
-
25844499734
-
Measurement of residual stress and elastic modulus of polycrystalline 3C-SiC films deposited by low-pressure chemical vapor deposition
-
Fu X.A., Dunning J.L., Zorman C.A., and Mehregany M. Measurement of residual stress and elastic modulus of polycrystalline 3C-SiC films deposited by low-pressure chemical vapor deposition. Thin Solid Films 492 (2005) 195
-
(2005)
Thin Solid Films
, vol.492
, pp. 195
-
-
Fu, X.A.1
Dunning, J.L.2
Zorman, C.A.3
Mehregany, M.4
-
11
-
-
0037051220
-
Growth and microhardness of SiC films by plasma-enhanced chemical vapor deposition
-
Seo J.Y., Yoon S.Y., Niihara K., and Kim K.H. Growth and microhardness of SiC films by plasma-enhanced chemical vapor deposition. Thin Solid Films 406 (2002) 138
-
(2002)
Thin Solid Films
, vol.406
, pp. 138
-
-
Seo, J.Y.1
Yoon, S.Y.2
Niihara, K.3
Kim, K.H.4
-
12
-
-
17244379776
-
Polycrystalline 3C-SiC thin films deposited by dual precursor LPCVD for MEMS application
-
Fu X.A., Dunning J.L., Zorman C.A., and Mehregany M. Polycrystalline 3C-SiC thin films deposited by dual precursor LPCVD for MEMS application. Sens. Actuators A199 (2005) 169
-
(2005)
Sens. Actuators
, vol.A199
, pp. 169
-
-
Fu, X.A.1
Dunning, J.L.2
Zorman, C.A.3
Mehregany, M.4
-
13
-
-
33646423286
-
Electrical characterization of n-type polycrystalline 3C-silicon carbide thin film deposited by 1,3-disilabutane
-
Zhang J., Howe R.T., and Maboudian R. Electrical characterization of n-type polycrystalline 3C-silicon carbide thin film deposited by 1,3-disilabutane. J. Electrochem. Soc. 153 (2006) 548
-
(2006)
J. Electrochem. Soc.
, vol.153
, pp. 548
-
-
Zhang, J.1
Howe, R.T.2
Maboudian, R.3
-
14
-
-
8744260852
-
Heteroepitaxial growth of 3C-SiC on SOI for sensor application
-
Krotz G., Moller H., Eickoff M., Zappe S., Ziermann R., Obermeier E., and Stoemenos J. Heteroepitaxial growth of 3C-SiC on SOI for sensor application. Mater. Sci. Eng. B 61-62 (1999) 516
-
(1999)
Mater. Sci. Eng. B
, vol.61-62
, pp. 516
-
-
Krotz, G.1
Moller, H.2
Eickoff, M.3
Zappe, S.4
Ziermann, R.5
Obermeier, E.6
Stoemenos, J.7
-
15
-
-
0030673371
-
A high temperature pressure sensor with β-SiC piezoresistors on SOI substrates
-
Chicago
-
Ziermann R., Berg J.V., Reichert W., Obermeier E., Eickoff M., and Krotz G. A high temperature pressure sensor with β-SiC piezoresistors on SOI substrates. Proceedings of the International Conference on Solid-State Sens. Actuat. Chicago (1997) 1411
-
(1997)
Proceedings of the International Conference on Solid-State Sens. Actuat.
, pp. 1411
-
-
Ziermann, R.1
Berg, J.V.2
Reichert, W.3
Obermeier, E.4
Eickoff, M.5
Krotz, G.6
|