Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies

Proceedings of the Fifth International Conference on Information Processing in Sensor Networks, IPSN '06

Volumn 2006, Issue , 2006, Pages 391-398

  Niedermayer, M ^a   Guttowski, S ^a   Thomasius, R ^b   Polityko, D ^b   Schrank, K ^b   Reichl, H ^b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

3D packaging; Design methodology; Hetero system integration; Wireless sensor systems

Indexed keywords

CHIP SCALE PACKAGES; EMBEDDED SYSTEMS; ROBUSTNESS (CONTROL SYSTEMS); SOFTWARE PROTOTYPING; WIRELESS SENSOR NETWORKS; DECISION THEORY; MICROCONTROLLERS;

3D PACKAGING; DESIGN METHODOLOGY; HETERO SYSTEM INTEGRATION; WIRELESS SENSOR SYSTEMS;

MICROCONTROLLERS; WIRELESS SENSOR NETWORKS;

3D PACKAGING; DESIGN METHODOLOGY; HETERO SYSTEM INTEGRATION; WIRELESS SENSOR SYSTEMS;

EID: 34247511570     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1127777.1127836     Document Type: Conference Paper

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