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Volumn 50, Issue 3, 2007, Pages 700-707

Methodological study on the recycle of oxide-chemical mechanical polishing slurry

Author keywords

Chemical mechanical polishing (CMP); Diluted silica slurry (DSS); Mixed abrasive slurry (MAS); Mixing of original slurry (MOS); Recycle slurry; Removal rate (RR); Within wafer non uniformity (WIWNU)

Indexed keywords


EID: 34147137737     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.50.700     Document Type: Article
Times cited : (8)

References (15)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.