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Volumn 50, Issue 3, 2007, Pages 700-707
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Methodological study on the recycle of oxide-chemical mechanical polishing slurry
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Author keywords
Chemical mechanical polishing (CMP); Diluted silica slurry (DSS); Mixed abrasive slurry (MAS); Mixing of original slurry (MOS); Recycle slurry; Removal rate (RR); Within wafer non uniformity (WIWNU)
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Indexed keywords
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EID: 34147137737
PISSN: 03744884
EISSN: None
Source Type: Journal
DOI: 10.3938/jkps.50.700 Document Type: Article |
Times cited : (8)
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References (15)
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