SCOPUS 정보 검색 플랫폼

Electronics Letters

Volumn 40, Issue 24, 2004, Pages 1553-1554

Recycling method for used slurry by annealed filtering

(3) Seo, Y J a Kim, N H b Lee, W S b

a Daebul University (South Korea)

b Chosun University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; ANNEALING; CHEMICAL MECHANICAL POLISHING; DIELECTRIC DEVICES; ELECTRIC FURNACES; FILTRATION; PARTICLE SIZE ANALYSIS; POWDER METALS; SCANNING ELECTRON MICROSCOPY; SILICA; SLURRIES; STRENGTH OF MATERIALS; WATER;

ABRASIVE POWDERS; INTER-METAL DIELECTRIC (IMD) LAYERS; PRE-METAL DIELECTRIC (PMD) LAYERS; SILICA ABRASIVE SLURRY;

RECYCLING;

EID: 10944256658 PISSN: 00135194 EISSN: None Source Type: Journal
DOI: 10.1049/el:20045730 Document Type: Article

Times cited : (3)

References (6)

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- Kaufman, F.B.¹ Thompson, D.B.² Broadie, R.E.³ Jaso, M.A.⁴ Gutherie⁵ Pearson, W.L.⁶ Small, M.B.⁷

2
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- Slurry induced metallic contaminations on different silicate oxides by as-deposited and post-CMP cleaning
- Santa Clara, CA, USA, February
- Seo, Y.J., Park, S.W., Jeong, S.Y., Choi, W.S., and Kim, S.Y.: 'Slurry induced metallic contaminations on different silicate oxides by as-deposited and post-CMP cleaning'. 6th CMP-MIC Conf, Santa Clara, CA, USA, February 2001, pp. 287-290
- (2001) 6th CMP-MIC Conf , pp. 287-290
- Seo, Y.J.¹ Park, S.W.² Jeong, S.Y.³ Choi, W.S.⁴ Kim, S.Y.⁵

3
- 0035455080
- Optimization of pre-metal dielectric (PMD) materials
- Seo, Y.J., Kim, S.Y., and Lee, W.S.: 'Optimization of pre-metal dielectric (PMD) materials', J. Mater. Sci. Mater. Electron., 2001, 12, (9), pp. 551-554
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- Seo, Y.J.¹ Kim, S.Y.² Lee, W.S.³

4
- 0037306744
- Global planarization characteristics of shallow trench isolation-chemical mechanical polishing process with and without reverse moat etch step
- Seo, Y.J., Park, S.W., Kim, C.B., Kim, S.Y., Lee, W.S., and Park, J.S.: 'Global planarization characteristics of shallow trench isolation-chemical mechanical polishing process with and without reverse moat etch step', J. Korean Phys. Soc., 2003, 42, (92), pp. 421-424
- (2003) J. Korean Phys. Soc. , vol.42 , Issue.92 , pp. 421-424
- Seo, Y.J.¹ Park, S.W.² Kim, C.B.³ Kim, S.Y.⁴ Lee, W.S.⁵ Park, J.S.⁶

5
- 0034998950
- An optimization of tungsten plug chemical mechanical polishing (CMP) using different consumables
- Lee, W.S., Kim, S.Y., Seo, Y.J., and Lee, J.K.: 'An optimization of tungsten plug chemical mechanical polishing (CMP) using different consumables', J. Mat. Sci., 2001, 12, (1) pp. 63-68
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6
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- Effect of particle size of chemical mechanical polishing slurries for enhanced polishing with minimal defects
- Basim, G.B., Adler, J.J., Mahajan, U., Singh, R.K., and Moudgil, B.M.: 'Effect of particle size of chemical mechanical polishing slurries for enhanced polishing with minimal defects', J. Electrochem. Soc., 2000, 147, (9), pp. 3523-3528
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- Basim, G.B.¹ Adler, J.J.² Mahajan, U.³ Singh, R.K.⁴ Moudgil, B.M.⁵

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