Skeletal Si-O-Si network connectivity of self-assembled porous silica for low-k dielectrics depending on organoalkoxysilane concentration in precursor solutions

Journal of Applied Physics

Volumn 101, Issue 6, 2007, Pages

  Takada, Syozo ^a   Hata, Nobuhiro ^a   Hayamizu, Kikuko ^a   Murakami, Miwa ^b   Deguchi, Kenzo ^b   Ohki, Shinobu ^b   Tansho, Masataka ^b   Shimizu, Tadashi ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); DIELECTRIC MATERIALS; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; SELF ASSEMBLY; SILANES; STRENGTH OF MATERIALS;

DIMETHYLDIETHOXYSILANE (DMDEOS); HYDROXYL FUNCTIONAL GROUPS; MAGIC-ANGLE-SPINNING NUCLEAR MAGNETIC RESONANCE (MAS NMR); ORGANOALKOXYSILANE; PRECURSOR SOLUTIONS; TETRAETHOXYSILANE (TEOS);

POROUS SILICON;

EID: 34047137092     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2512648     Document Type: Article

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