High temperature embedded power module

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 2005, Pages 357-361

  Yin, Jian ^a   Liang, Zhenxian ^a   Van Wyk, J D ^a  

^a State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; HIGH TEMPERATURE OPERATIONS; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; POWER ELECTRONICS; STRESS ANALYSIS; SWITCHING CIRCUITS;

3-D INTEGRATION PACKAGING TECHNOLOGY; HIGH ENVIRONMENTAL TEMPERATURE; HIGH TEMPERATURE MODULE; STATE-OF-THE-ART TECHNOLOGY;

EMBEDDED SYSTEMS;

EID: 33744986709     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2005.1452953     Document Type: Conference Paper

References (9)

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