Measurement and modeling of back stress at intermediate to high homologous temperatures

International journal of plasticity

Volumn 16, Issue 3, 2000, Pages 283-301

  Neu, R W ^a   Scott, D T ^a   Woodmansee, M W ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLIC LOADS; HIGH TEMPERATURE EFFECTS; MATHEMATICAL MODELS; PLASTICITY; SOLDERING ALLOYS; STRAIN; STRESS ANALYSIS; TIN ALLOYS;

BACK STRESS; CREEP-PLASTICITY MODELS;

CREEP;

EID: 0033887269     PISSN: 07496419     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0749-6419(99)00055-8     Document Type: Article

References (24)

1. Ahlquist C.N., Nix W.D. A technique for measuring mean internal stress during high temperature creep. Scripta Metallurgica. 3:1969;679.
2. Ahlquist C.N., Nix W.D. The measurement of internal stresses during creep of Al and Al-Mg alloys. Acta Metallurgica. 19:1971;373.
3. Argon A.S., Takeuchi S. Internal stresses in power-law creep. Acta Metallurgica. 29:1981;1877.
4. Bird, J.E., Mukherjee, A.K., Dorn, J.E., 1969. Correlations between high-temperature creep behavior and structure. In: Quantitative Relation Between Properties and Microstructure, Brandon, D.G., Rosen, A. (Eds), Israel Universities Press, Jerusalem, p. 255.
5. Cadek J. The back stress concept in power law creep of metals: a review. Materials Science and Engineering. 94:1987;79.
6. Chaboche J.L., Rousselier G. On the plastic and viscoplastic constitutive equations - part 1: rules developed with internal variable concept. Journal of Pressure Vessel Technology. 105:1983;153.
7. Gibeling J.C., Nix W.D. The description of elevated temperature deformation in terms of threshold stresses and back stresses: a review. Materials Science and Engineering. 45:1980;123.
8. Gibeling J.C., Nix W.D. A numerical study of long range internal stresses associated with subgrain. Acta Metallurgica. 28:1980;1743.
9. Hasegawa T., Ikeuchi Y., Karashima S. Internal stress and dislocation structure during sigmoidal transient creep of a copper-16 at% aluminum alloy. Metal Science Journal. 6:1972;78.
10. Langdon, T.G., 1985. Dislocations and creep. In: Dislocations and Properties of Real Materials. The Institute of Metals, p. 221.
11. Lowe T.C., Miller A.K. Improved constitutive equations for modeling strain softening - part I: conceptual development. Journal of Engineering Materials and Technology. 106(4):1984;337.
12. McDowell D.L. A nonlinear kinematic hardening theory for cyclic thermoplasticity and thermoviscoplasticity. International Journal of Plasticity. 8:1992;695.
13. McDowell D.L., Miller M.P., Brooks D.C. A unified creep-plasticity theory for solder alloys. Schroeder S.A., Mitchell M.R. Fatigue of Electronic Materials, ASTM STP 1153. 1994;42 American Society for Testing and Materials, Philadelphia.
14. McDowell D.L., Moosbrugger J.C. A generalized rate-dependent bounding surface model. ASME PVP. 129:1987;1.
15. Moosbrugger J.C., McDowell D.L. A rate-dependent bounding surface model with a generalized image point for cyclic nonproportional viscoplasticity. J. Mech. Phys. Solids. 38(5):1990;627.
16. Neu, R.W., Scott, D.T., Woodmansee, M.W., 1999. Thermomechanical behavior of 96Sn-4Ag and castin alloy. Journal of Electronic Packaging, in review.
17. Onat, E.T., 1976. Representation of inelastic behavior, Yale University Subcontract Report to Oak Ridge National Laboratory, ORNL/Sub/3863-2.
18. Raj, S.V., Iskovitz, I.S., Freed, A.D., 1996. Modeling the role of dislocation substructure during Class M and exponential creep. In: Unified Constitutive Laws of Plastic Deformation, Krausz, A.S., Krausz, K. (Eds.), Academic Press, Chapter 8, p. 343.
19. Sehitoglu H. Changes in state variables at elevated temperatures. Journal of Engineering Materials and Technology. 111:1989;192.
20. Stolkarts, V., Moran, B., Keer, L.M., 1998. Constitutive and damage model for solders. In: Proceeding of the 48th Electronic Components and Technology Conf., Seattle, WA, p. 379.
21. Takeuchi S., Argon A.S. Steady-state creep of single-phase crystalline matter at high temperature. Journal of Materials Science. 11:1976;1542.
22. Whitelaw R.S., Neu R.W., Scott D.T. Deformation behavior of two lead-free solders: indalloy 227 and castin alloy. Journal of Electronic Packaging. 121:1999;99.
23. Woodmansee, M.W., Neu, R.W., 1999. Response of 60Sn-40Pb under thermal and mechanical cycling. In: Third Symposium on Thermo-mechanical Fatigue Behavior of Materials, ASTM STP 1371, Sehitoglu, H., Maier, H.J. (Eds.), American Society for Testing and Materials, West Conshohocken, PA.
24. Yavari P., Mohamed F.A., Langdon T.G. Creep and substructure formation in an Al-5% Mg solid solution alloy. Acta Metallurgica. 29:1981;1495.