Integration of an RF MEMS resonator with a bulk CMOS process using a low-temperature and dry-release fabrication method

Journal of Micromechanics and Microengineering

Volumn 17, Issue 1, 2007, Pages 20-25

  Gong, Jing Feng ^a   Xiao, Zhi Yong ^a   Chan, Philip C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE; CMOS INTEGRATED CIRCUITS; ELECTRODES; MICROELECTROMECHANICAL DEVICES; PLASMAS; SINGLE CRYSTALS;

BRIDGE RESONATOR; ISOTROPIC SILICON ETCH; POLYMERIC LAYER; SINGLE CRYSTAL SILICON;

RESONATORS;

EID: 33947593180     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/1/003     Document Type: Article

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