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Volumn 20, Issue 1, 2007, Pages 5-12

An in situ approach to real-time spatial control of steady-state wafer temperature during thermal processing in microlithography

Author keywords

Microlithography; Photoresist processing; Real time control; Semiconductor manufacturing; Temperature control

Indexed keywords

EMBEDDED SENSORS; PHOTORESIST PROCESSING; SEMICONDUCTOR MANUFACTURING; THERMAL PROCESSING; THERMAL SYSTEMS; WAFER TEMPERATURE;

EID: 33847748223     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2007.890770     Document Type: Article
Times cited : (17)

References (16)
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    • Parker, J.1    Renken, W.2
  • 3
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    • Chemically amplified resists for advanced lithography: Road to success or detour?
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    • Seeger, D.1
  • 7
    • 0036688504 scopus 로고    scopus 로고
    • Resist film uniformity in the microlithography process
    • Aug
    • W. K. Ho, L. L. Lee, A. Tay, and C. Schaper, "Resist film uniformity in the microlithography process," IEEE Trans. Semicond. Manuf., vol. 15, no. 3, pp. 323-330, Aug. 2002.
    • (2002) IEEE Trans. Semicond. Manuf , vol.15 , Issue.3 , pp. 323-330
    • Ho, W.K.1    Lee, L.L.2    Tay, A.3    Schaper, C.4
  • 8
    • 0008706926 scopus 로고    scopus 로고
    • Spatially programmable thermal processing module for semiconductors,
    • Ph.D. thesis, Stanford Univ, Stanford, CA
    • K. A. El-Awady, "Spatially programmable thermal processing module for semiconductors," Ph.D. thesis, Stanford Univ., Stanford, CA, 2000.
    • (2000)
    • El-Awady, K.A.1
  • 9
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    • In situ fault detection of wafer warpage in microlithography
    • Aug
    • W. K. Ho, A. Tay, Y. Zhou, and K. Yang, "In situ fault detection of wafer warpage in microlithography," IEEE Trans. Semicond. Manuf., vol. 17, no. 3, pp. 402-407, Aug. 2004.
    • (2004) IEEE Trans. Semicond. Manuf , vol.17 , Issue.3 , pp. 402-407
    • Ho, W.K.1    Tay, A.2    Zhou, Y.3    Yang, K.4
  • 10
    • 22944434184 scopus 로고    scopus 로고
    • Estimation of wafer warpage profile during thermal processing in microlithography
    • A. Tay, W. K. Ho, N. Hu, and X. Q. Chen, "Estimation of wafer warpage profile during thermal processing in microlithography," Rev. Sci. Instrum., vol. 76, no. 7, pp. 075111-075117, 2005.
    • (2005) Rev. Sci. Instrum , vol.76 , Issue.7 , pp. 075111-075117
    • Tay, A.1    Ho, W.K.2    Hu, N.3    Chen, X.Q.4
  • 13
    • 4344682782 scopus 로고    scopus 로고
    • Programmable thermal processing module for semiconductor substrates
    • Jul
    • K. El-Awady, C. D. Schaper, and T. Kailath, "Programmable thermal processing module for semiconductor substrates," IEEE Trans. Control Syst. Technol., vol. 12, no. 4, pp. 493-509, Jul. 2004.
    • (2004) IEEE Trans. Control Syst. Technol , vol.12 , Issue.4 , pp. 493-509
    • El-Awady, K.1    Schaper, C.D.2    Kailath, T.3
  • 14
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    • Integrated bake/chill module with in situ temperature measurement for photoresist processing
    • May
    • A. Tay, W. K. Ho, A. P. Loh, K. W. Lim, W. W. Tan, and C. D. Schaper, "Integrated bake/chill module with in situ temperature measurement for photoresist processing," IEEE Trans. Semicond. Manuf., vol. 17, no. 2, pp. 231-242, May 2004.
    • (2004) IEEE Trans. Semicond. Manuf , vol.17 , Issue.2 , pp. 231-242
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.