Temperature metrology for CD control in DUV lithography

Semiconductor International

Volumn 20, Issue 10, 1997, Pages 111-116

  Parker, Jeffrey ^a   Renken, Wayne ^a  

^a SensArray Corp   (United States)

Author keywords

CD control; DUV; Photolithography

Indexed keywords

COATINGS; COMPUTER AIDED SOFTWARE ENGINEERING; COMPUTER SYSTEMS; DATA ACQUISITION; SEMICONDUCTING SILICON; SENSORS; SUBSTRATES; TEMPERATURE CONTROL; TEMPERATURE MEASUREMENT; THERMAL EFFECTS; THERMOCOUPLES; ULTRAVIOLET RADIATION;

COMPUTER AIDED DATA ACQUISITION; CRITICAL DIMENSION CONTROL; DEEP ULTRAVIOLET LITHOGRAPHY;

PHOTOLITHOGRAPHY;

EID: 0031232635     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Fadda, E., Clarisse, C. and Paniez, P.J., "Study of Bake Mechanisms in Novolak Based Photoresist Films: Investigation by Contact Angle Measurements," SPIE Proceedings, vol. 2724, pp. 460-468.
2. Palmer, E., Ren, W., Spanos, C.J. and Poolla, K., "Control of Photoresist Properties: a Kalman Filter Based Approach," IEEE Transactions on Semiconductor Manufacturing, vol. 9, no. 2, May 1996, p. 208-214.
3. McCallum, M. and Bienkowski, J., "Cost Effective Processing of Advanced Organic ARC Lithography," Semiconductor FABTECH, Fourth Edition, p. 161-166.
4. Reichmanis, E., "Chemically Amplified Deep-Ultraviolet Photoresist," Advanced Materials & Processes, Sept. 1996, p. 41-42.
5. Katsumata, M., Kawahira, H., Sugawara, M. and Nozawa, S., "A Chemically Amplified Resist Process for 0.25 μm Generation Photomasks," SPIE Proceedings, vol. 2793, p. 96-104.