Integrated bake/chill module with in situ temperature measurement for photoresist processing

IEEE Transactions on Semiconductor Manufacturing

Volumn 17, Issue 2, 2004, Pages 231-242

  Tay, Arthur ^a   Ho, Weng Khuen ^a   Loh, Ai Poh ^a   Lim, Khiang Wee ^a   Tan, Woei Wan ^a   Schaper, Charles D ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b Stanford University   (United States)

Author keywords

300 mm wafer processing; In situ temperature measurement; Lithography; Photoresist processing

Indexed keywords

300-MM WAFER PROCESSING; ETCHING STABILITY; IN SITU TEMPERATURE MEASUREMENT; PHOTORESIST PROCESSING;

CLOSED LOOP CONTROL SYSTEMS; ELECTRIC CURRENTS; HEATING; LITHOGRAPHY; REAL TIME SYSTEMS; SILICON WAFERS; SPIN COATING; ULTRAVIOLET RADIATION;

PHOTORESISTORS;

EID: 2642539990     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.826959     Document Type: Conference Paper

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