Challenges in evaluating thickness, phase, and strain in semiconductor devices using high-resolution transmission electron microscopy

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2006, Issue , 2006, Pages 343-350

  Rai, Raghaw ^a   Conner, James ^a   Murphy, Sharon ^a   Subramanian, Swaminathan ^b  

^a Freescale Semiconductor   (United States)

^b Freescale Semiconductor   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33847632854     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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