A multifunctional test chip for microelectronic packaging and its application on RF property measurements

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging

Volumn 2005, Issue , 2005, Pages 78-82

  Tseng, Kun Fu ^a   Hsion, Yi Hsun ^b   Lwo, Ben Je ^b   Kao, Chin Hsing ^b  

^a CHIN MIN INSTITUTE OF TECHNOLOGY   (Taiwan)

^b NATIONAL DEFENSE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC STRUCTURE; MICROELECTRONICS; MICROPROCESSOR CHIPS; POLYSILICON; SENSORS;

MICROELECTRONIC PACKAGING; PACKAGING DESIGNS; STRESS SENSORS; TEMPERATURE SENSOR;

ELECTRONICS PACKAGING;

EID: 33847325175     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2005.1598239     Document Type: Conference Paper

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