Advances in RF packaging technologies for next-generation wireless communications applications (invited paper)

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 2003, Pages 323-330

  Larson, Lawrence ^a   Jessie, Darryl ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; FLIP CHIP DEVICES; FREQUENCY ALLOCATION; LOCAL AREA NETWORKS; LOW TEMPERATURE PROPERTIES; PLASTICS APPLICATIONS; PRINTED CIRCUIT BOARDS; TRANSCEIVERS; WIRELESS TELECOMMUNICATION SYSTEMS;

LOW-TEMPERATURE CO-FIRED CERAMIC; RADIO FREQUENCY INTEGRATED CIRCUIT; SYSTEM-IN-PACKAGE; TRANSCEIVER CHIPS;

ELECTRONICS PACKAGING;

EID: 0242527286     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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