In-plane packaging stress measurements through piezoresistive sensors

Journal of Electronic Packaging

Volumn 124, Issue 2, 2002, Pages 115-121

  Lwo, Ben Je ^a   Chen, Tung Sheng ^a   Kao, Ching Hsing ^a   Lin, Yu Lin ^a,b  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b MACRONIX INTERNATIONAL CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012864294     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1452244     Document Type: Article

References (12)

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3. Bastawros, A. F., and Vososhin, A. S., 1990, "Thermal Strain Measurements in Electronic Packaging Through Fractional Fringe Moire Interferometry," ASME J. Electron. Packag., 112, No. 4. pp. 303-308.
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5. Lau, J. H., 1993, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold Co., New York.
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7. ZOu, Y., Suhling, J. C., Johnson, R. W., Jaeger, R. C., and Mian, A. K. N., 1999, "In-Situ Stress State Measurements During Chip-on-Board Assembly," IEEE Tran. on Electronic Packaging Manufacturing, 22, No 1, pp. 35-52.
8. Lin, C. Y. et al., 1999, "Calibration of Piezoresistive Stress Sensors in Electronic Packaging," The 6th Symposium on Nano Device Tech., pp. 173-176.
9. Chen, T. S. et al., 2000, "Application of Microelectronic Devices for Package-Induced Stress Measurement," Proc. of the 5th Annual Pan-Pacific Microelectronic Symposium, pp. 302-306.
10. Lwo, B. J., Kao, C. H., Chen, T. S., and Chen, Y. S., 2002, "On the study of piezoresistive Stress Sensors for Microelectronic Packaging," ASME J. Electron. Packag., 124, No. 1, pp. 22-26.
11. Jaeger, R. C., Suhling, J. C., Carey, M. T., and Johnson, R. W., 1993, "Off-Axis Sensor Rosette for Measurement of the Piezoresistive Coefficients of Silicon," IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, No. 8, pp. 925-930.
12. Lwo, B. J., Chen, Y. S., Chen, T S., Lee, G. M., Kao, C. H., Lin, C. Y., and Tseng, K. F., 2000, "Temperature Calibration on Piezoresistive Sensors," J. of Chung-Cheng Institute of Technology, 29, No. 1, pp. 15-22. (In Chinese)