Measurement of package inductance and capacitance matrices

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 1, 1996, Pages 225-229

  Young, Brian ^a   Sparkman, Aubrey K ^a  

^a MOTOROLA INC   (United States)

Author keywords

Capacitance matrices; Conductance; Inductance; Noise; Pin count; Quad flat pack; Resistance

Indexed keywords

CAPACITANCE MEASUREMENT; COMPUTER SIMULATION; ELECTRIC NETWORK ANALYSIS; ELECTRIC NETWORK ANALYZERS; ELECTRIC RESISTANCE MEASUREMENT; INDUCTANCE MEASUREMENT; LUMPED PARAMETER NETWORKS; MATHEMATICAL MODELS; MATRIX ALGEBRA; SPURIOUS SIGNAL NOISE;

CAPACITANCE MATRICES; CONDUCTANCE MATRIX; PACKAGE INDUCTANCE; PIN COUNT; QUAD FLAT PACK;

ELECTRONICS PACKAGING;

EID: 0030084701     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.486506     Document Type: Article

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