On the study of piezoresistive stress sensors for microelectronic packaging

Journal of Electronic Packaging

Volumn 124, Issue 1, 2002, Pages 22-26

  Lwo, Ben Je ^a   Kao, Ching Hsing ^a   Chen, Tung Sheng ^a   Chen, Yao Shing ^a,b  

^a NATIONAL DEFENSE UNIVERSITY   (Taiwan)

^b CHUNGHWA TELECOM CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039886668     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1414134     Document Type: Article

References (17)

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