A circuit topology for microwave modeling of plastic surface mount packages

IEEE Transactions on Microwave Theory and Techniques

Volumn 44, Issue 7 PART 1, 1996, Pages 1140-1146

  Jackson, Robert W ^a  

^a University of Massachusetts   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC NETWORK TOPOLOGY; ELECTROMAGNETIC FIELD EFFECTS; ELECTROMAGNETIC WAVE SCATTERING; ELECTRONICS PACKAGING; FREQUENCIES; MATHEMATICAL MODELS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL;

CIRCUIT TOPOLOGY; ELECTROMAGNETIC SIMULATION; MICROWAVE MODELING; PLASTIC SURFACE MOUNT PACKAGES; SCATTERING PARAMETERS; THREE DIMENSIONAL PLANAR SIMULATION PACKAGE;

ELECTROMAGNETIC FIELD THEORY;

EID: 0030196466     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.508649     Document Type: Article

References (6)

1. F. Ndagijimata et al., ;The inductive connection effects of a mounted SPDT in a plastic SO8 package,; in IEEE Microwave Theory Tech. Symp. Dig., June 1993, pp. 91-94.
2. Em and Emvu are trademarks of SONNET Inc., 135 Old Cove Road, Suite 203, Liverpool, NY.
3. J. C. Rautio, ;Synthesis of lumped models from N-port scattering parameter data,; IEEE Trans. Microwave Theory Tech., vol. 42, no. 3, pp. 535-537, Mar. 1994.
4. F. W. Grover, Inductance Calculations: Working Formulas and Tables. New York: Dover, 1973.
5. H. Y. Lee, ;Wideband characterization of mutual coupling between high density bonding wires,; IEEE Microwave Guided Wave Lett., vol. 4, no. 8, pp. 265-267, Aug. 1994.
6. S. K. Yun and H. Y. Lee, ;Parasitic impedance analysis of double bonding wires for high frequency integrated circuit packaging,; IEEE Microwave Guided Wave Lett., vol. 5, no. 9, pp. 296-298, Sept. 1995.