Challenges in the manufacture of glass substrates for electrical and optical interconnect

Circuit World

Volumn 33, Issue 1, 2007, Pages 22-30

  Hutt, David A ^a   Williams, Karen ^a   Conway, Paul P ^a   Khoshnaw, Faud M ^a   Cui, Xiaoyun ^a   Bhatt, Deepa ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Copper; Glass; Laminates; Lasers; Substrates

Indexed keywords

ELECTROLESS PLATING; EXCIMER LASERS; FATIGUE TESTING; INTEGRATED OPTOELECTRONICS; INTERCONNECTION NETWORKS; LAMINATES; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES;

ELECTROLESS COPPER METALLISATION; MULTILAYER GLASS SUBSTRATES;

GLASS MANUFACTURE;

EID: 33847305100     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120710723689     Document Type: Article

References (15)

1. Crafer, R. and Oakley, P.J. (1992), Laser Processing in Manufacturing (Engineering Aspects of Lasers Series 2), Kluwer Academic Publishers, Dordrecht.
2. Delamarche, E. et al. (2003a), "Electroless deposition of copper on glass and patterning with microcontact printing", Langmuir, Vol. 19, pp. 6567-9.
3. Delamarche, E. et al. (2003b), "Electroless deposition of NiB on 15 inch glass substrates for the fabrication of transistor gates for liquid crystal displays", Langmuir, Vol. 19, pp. 5923-35.
4. Geissler, M. et al. (2003), "Direct patterning of NiB on glass substrates using microcontact printing and electroless deposition", Langmuir, Vol. 19, pp. 6283-96.
5. Kumar, A. et al. (1994), "Patterning self-assembled monolayers: applications in materials science", Langmuir, Vol. 10, pp. 1498-511.
6. Lau, J.H. (2000), Low Cost Flip-chip Technologies, McGraw-Hill, New York, NY.
7. Lau, J.H. and Lee, S.W.R. (2001), Microvias for Low Cost, High Density Interconnects, McGraw-Hill, New York, NY.
8. Liao, Y.S. et al. (2005), "Surface morphology and sub-surface damaged layer of various glasses machined by 193nm ArF excimer laser", Proc. of the Society of Photo-optical Instrumentation Engineers (SPIE): Micromachining and Microfabication Process Technology X, San Jose, CA, January, Vol. 5715, pp. 110-7.
9. Min, H.S. et al. (2004), "Effects of wafer cleaning and annealing on glass/silicon wafer direct bonding", J. Electronic Packaging, Vol. 126, pp. 120-3.
10. Sayah, A. et al. (2000), "Development of novel low temperature bonding technologies for microchip chemical analysis applications", Sensors and Actuators, Vol. 84, pp. 103-8.
11. Schroder, H. et al. (2003), "Planar glass waveguides for high performance electrical-optical-circuit boards (EOCB) - the glass layer concept", Proc. 53rd Electronic Components and Technology Conf, New Orleans, May, pp. 1053-9.
12. Uhlig, S. et al. (2006), "Polymer optical interconnects - a scalable large-area panel processing approach", IEEE Trans. Adv. Pack., Vol. 29, pp. 158-70.
13. Van der Putten, A.M.T. et al. (1992), "Electrochemistry of colloidal palladium - an experimental study of sol formation and electrocatalysis", J. Electrochem. Soc., Vol. 139, pp. 3475-80.
14. Vardaman, E.J. (2003), "Growing demand for flip chip", Advancing Microelectronics, January/February, pp. 10-12.
15. Vincent, M.B. and Wong, C.P. (1999), "Enhancement of underfill encapsulants for flip-chip technology", Soldering & Surface Mount Technology, Vol. 11, pp. 33-9.