Effects of wafer cleaning and annealing on glass/silicon wafer direct bonding

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 120-123

  Min, Hong Seok ^a   Joo, Young Chang ^a   Song, Oh Sung ^b  

^a Seoul National University   (South Korea)

^b University of Seoul   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BONDING; GLASS; HEAT TREATMENT; POLISHING; SILICON; SURFACE CLEANING; VAN DER WAALS FORCES;

MATING SURFACES; ROOM TEMPERATURE BONDING; WAFER CLEANING; WAFER DIRECT BONDING (WDB);

WSI CIRCUITS;

EID: 8744228977     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1649238     Document Type: Article

References (9)

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