Polymer optical interconnects - A scalable large-area panel processing approach

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 1, 2006, Pages 158-170

  Uhlig, Steffen ^a   Fröhlich, Lothar ^b   Chen, Miaoxiang ^a   Arndt Staufenbiel, Norbert ^c   Lang, Günter ^c   Schröder, Henning ^c   Houbertz, Ruth ^b   Popall, Michael ^b   Robertsson, Mats ^a,d  

^a LINKÖPING UNIVERSITY   (Sweden)

^b FRAUNHOFER INSTITUTE FOR SILICATE RESEARCH ISC   (Germany)

^c FRAUNHOFER IZM   (Germany)

^d ACREO AB   (Sweden)

Author keywords

Flexible manufacturing approach; Hybrid polymers; Large area processing; Optical backplane; Optical interconnect review; ORMOCER; Polymer optical waveguide; Projection UV lithogaphy

Indexed keywords

ADHESION; FLEXIBLE MANUFACTURING SYSTEMS; INTEGRATED OPTOELECTRONICS; OPTICAL WAVEGUIDES; PHOTOLITHOGRAPHY; POLYMERS; REFRACTIVE INDEX;

HYBRID POLYMERS; LARGE AREA PROCESSING; OPTICAL BACKPLANE; POLYMER OPTICAL WAVEGUIDE; PROJECTION UV LITHOGRAPHY;

OPTICAL INTERCONNECTS;

EID: 32444431803     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.849555     Document Type: Article

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