In situ transmission electron microscopy study of plastic deformation and stress-induced voiding in Al-Cu interconnects

Journal of Applied Physics

Volumn 82, Issue 4, 1997, Pages 1563-1577

  Jawarani, D ^a   Kawasaki, H ^a   Yeo, I S ^b   Rabenberg, L ^b   Stark, J P ^b   Ho, P S ^b  

^a MOTOROLA INC   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000124841     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.365957     Document Type: Article

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