Stress relaxation and microstructural change in passivated Al(Cu) lines

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1996, Pages 131-138

  Yeo, In Seok ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRUCTURE; PASSIVATION; SCANNING ELECTRON MICROSCOPY; STRESS RELAXATION; THERMAL EFFECTS; THERMAL STRESS; TRANSMISSION ELECTRON MICROSCOPY;

MICROSTRUCTURAL CHANGE; STRESS INDUCED VOIDING; VOID FORMATION;

SEMICONDUCTING ALUMINUM COMPOUNDS;

EID: 0029700578     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)