Ebullient cooling of integrated circuits by NOVEC fluids

Advances in Electronic Packaging

Volumn 2, Issue , 2001, Pages 625-637

  Arik, Mehmet ^a   Bar Cohen, Avram ^b  

^a GENERAL ELECTRIC COMPANY   (United States)

^b University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SATURATION TEMPERATURE; THERMAL EFFUSIVITY;

COOLING; DIELECTRIC LIQUIDS; ERROR ANALYSIS; HEAT FLUX; HEAT TRANSFER; INTEGRATED CIRCUITS; MICROELECTRONICS; NUCLEATION; PRESSURE EFFECTS; THERMAL CONDUCTIVITY; TWO PHASE FLOW;

ELECTRONICS PACKAGING;

EID: 0348199194     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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