-
2
-
-
0031620348
-
Towards optimizing enhanced surfaces for passive immersion cooled heat sinks
-
Seattle, WA, 27-30 May
-
Baldwin, C. S., Bhavnani, S. H., Jaeger, R. C., "Towards Optimizing Enhanced Surfaces for Passive Immersion Cooled Heat Sinks," Proceedings Intersociety Conference on Thermal and Thermotechnical Phenomena in Electronic Systems, Seattle, WA, 27-30 May 1998, pp. 399-407.
-
(1998)
Proceedings Intersociety Conference on Thermal and Thermotechnical Phenomena in Electronic Systems
, pp. 399-407
-
-
Baldwin, C.S.1
Bhavnani, S.H.2
Jaeger, R.C.3
-
3
-
-
0000013494
-
Heater orientation effects on pool boiling of microporous enhanced surfaces in saturated FC-72
-
Chang, J. Y., You, S. M., "Heater Orientation Effects on Pool Boiling of Microporous Enhanced Surfaces in Saturated FC-72," J. Heat Transfer, 118, (1996) pp. 937-943.
-
(1996)
J. Heat Transfer
, vol.118
, pp. 937-943
-
-
Chang, J.Y.1
You, S.M.2
-
4
-
-
0242411634
-
Combined effects of subcooling and surface orientation on pool boiling of HFE-7100 from a simulated electronic chip
-
El-Genk, M. S., Bostanci, H.,"Combined Effects of Subcooling and Surface Orientation on Pool Boiling of HFE-7100 from a Simulated Electronic Chip," Experimental Heat Transfer, 16, (2003) pp. 281-301.
-
(2003)
Experimental Heat Transfer
, vol.16
, pp. 281-301
-
-
El-Genk, M.S.1
Bostanci, H.2
-
6
-
-
0002159808
-
The role of surface conditions in nucleate boiling
-
Griffith, P., Wallis, J. D.,"The Role of Surface Conditions in Nucleate Boiling," Chemical Engineering Progress Symposium Series No. 49(56), (1960), pp. 49-63.
-
(1960)
Chemical Engineering Progress Symposium Series No. 49
, vol.49
, Issue.56
, pp. 49-63
-
-
Griffith, P.1
Wallis, J.D.2
-
7
-
-
0036536682
-
Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron scale roughness
-
Honda, H., Takamatsu, H., Wei, J., "Enhanced Boiling of FC-72 on Silicon Chips with Micro-Pin-Fins and Submicron Scale Roughness," J. Heat Transfer, 124, (2002) pp. 383-390.
-
(2002)
J. Heat Transfer
, vol.124
, pp. 383-390
-
-
Honda, H.1
Takamatsu, H.2
Wei, J.3
-
8
-
-
0346039054
-
Advances in enhanced boiling heat transfer from electronic components
-
Honda, H., Wei, J., "Advances in Enhanced Boiling Heat Transfer From Electronic Components," JSME International Journal, Series B: Fluids and Thermal Engineering, 46, (2003), pp. 479-490.
-
(2003)
JSME International Journal, Series B: Fluids and Thermal Engineering
, vol.46
, pp. 479-490
-
-
Honda, H.1
Wei, J.2
-
9
-
-
0032623814
-
Effects of size and number density of micro-reentrant cavities on boiling heat transfer from a silicon chip immersed in degassed and gas dissolved FC-72
-
Kubo, H., Takamatsu, H., Honda, H.,"Effects of Size and Number Density of Micro-Reentrant Cavities on Boiling Heat Transfer from a Silicon Chip Immersed in Degassed and Gas Dissolved FC-72," Enhanced Heat Transfer, 6, (1999) pp. 151-160.
-
(1999)
Enhanced Heat Transfer
, vol.6
, pp. 151-160
-
-
Kubo, H.1
Takamatsu, H.2
Honda, H.3
-
10
-
-
84984086937
-
The effects of superheat and surface roughness on boiling coefficient
-
Kurihara, H.M., Meyers, J. E.,"The Effects of Superheat and Surface Roughness on Boiling Coefficient," American Institute of Chemical Engineers J., 6, (1960) pp. 83-91.
-
(1960)
American Institute of Chemical Engineers J.
, vol.6
, pp. 83-91
-
-
Kurihara, H.M.1
Meyers, J.E.2
-
12
-
-
0003443414
-
On the relevance of the liquid-vapor exchange mechanisms for subcooled boiling heat transfer at high pressures
-
UK Atomic Energy Authority, Winfrith, England
-
Ivey, H. and Morris, D., On the Relevance of the Liquid-Vapor Exchange Mechanisms for Subcooled Boiling Heat Transfer at High Pressures, Report AEEW-R137, UK Atomic Energy Authority, Winfrith, England, 1962.
-
(1962)
Report AEEW-R137
-
-
Ivey, H.1
Morris, D.2
-
13
-
-
0035300205
-
Pool boiling of FC-72 and HFE-7100
-
Liu, Z. W., Lin, W. W., Lee, D. J., "Pool Boiling of FC-72 and HFE-7100,"J. Heat Transfer, 123, (2001) pp. 399-400.
-
(2001)
J. Heat Transfer
, vol.123
, pp. 399-400
-
-
Liu, Z.W.1
Lin, W.W.2
Lee, D.J.3
-
14
-
-
0029108439
-
A painting technique to enhance pool boiling heat transfer in FC-72
-
O'Connor, J. P., You, S. M., "A Painting Technique to Enhance Pool Boiling Heat Transfer in FC-72," J. Heat Transfer, 117, (1995) pp. 387-393.
-
(1995)
J. Heat Transfer
, vol.117
, pp. 387-393
-
-
O'Connor, J.P.1
You, S.M.2
-
15
-
-
85041150297
-
-
Wiley and Sons, New York
-
Peterson, G., An Introduction to Heat Pipes: Modeling, Testing, and Applications, Wiley and Sons, New York, 1994.
-
(1994)
An Introduction to Heat Pipes: Modeling, Testing, and Applications
-
-
Peterson, G.1
-
16
-
-
0034251955
-
Pool boiling heat transfer from plain and microporous, square pin-finned surfaces in saturated FC-72
-
Rainey, K., You, S.,"Pool Boiling Heat Transfer from Plain and Microporous, Square Pin-Finned Surfaces in Saturated FC-72," J. Heat Transfer, 122, (2000) pp. 509-516.
-
(2000)
J. Heat Transfer
, vol.122
, pp. 509-516
-
-
Rainey, K.1
You, S.2
-
17
-
-
0038239861
-
Effect of pressure, subcooling, and dissolved gas on pool boiling from microporous surfaces in FC-72
-
Rainey, K., You, S., Lee, S., "Effect of Pressure, Subcooling, and Dissolved Gas on Pool Boiling from Microporous Surfaces in FC-72," J. Heat Transfer, 125, (2003) pp. 75-83.
-
(2003)
J. Heat Transfer
, vol.125
, pp. 75-83
-
-
Rainey, K.1
You, S.2
Lee, S.3
-
18
-
-
0026818028
-
Surface factors influencing burnout on flat heaters
-
Ramilison, J. M., Sadasivan, P., Lienhard, J. H., "Surface Factors Influencing Burnout on Flat Heaters," J. Heat Transfer, 114(1), (1992), pp. 287-290.
-
(1992)
J. Heat Transfer
, vol.114
, Issue.1
, pp. 287-290
-
-
Ramilison, J.M.1
Sadasivan, P.2
Lienhard, J.H.3
-
19
-
-
0001899168
-
Influences of porous coating on the boiling burnout heat flux
-
B. Sunden et al., eds.
-
Tehver, J.,"Influences of Porous Coating on the Boiling Burnout Heat Flux," Recent Advances in Heat Transfer, B. Sunden et al., eds.,1992, pp. 231-242.
-
(1992)
Recent Advances in Heat Transfer
, pp. 231-242
-
-
Tehver, J.1
-
21
-
-
0031168913
-
Combined pressure and subcooling effects on pool boiling from a PPGA chip package
-
Watwe A., Bar-Cohen, A., McNiel, A., "Combined Pressure and Subcooling Effects on Pool Boiling from a PPGA Chip Package," J. Electronic Packaging, 119 (1997), pp 95-105.
-
(1997)
J. Electronic Packaging
, vol.119
, pp. 95-105
-
-
Watwe, A.1
Bar-Cohen, A.2
McNiel, A.3
|