Thermal analyses of composite copper/ porous graphite spreaders for immersion cooling applications

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART A, Issue , 2005, Pages 305-314

  El Genk, Mohamed S ^a   Saber, Hamed H ^a   Parker, Jack ^a  

^a MSC01 1070   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HEAT RESISTANCE; NUCLEATE BOILING; POROUS MATERIALS; SPREADERS; THERMOANALYSIS;

COMPUTER CHIPS; POROUS GRAPHITE; POROUS GRAPHITE SPREADERS; THERMAL POWERS;

COPPER;

EID: 32844466925     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73226     Document Type: Conference Paper

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