Direct liquid cooling of a stacked MCM

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 199-206

  Chen, X Y ^a   Toh, K C ^a   Wong, T N ^a   Chai, J C ^a   Pinjala, D ^b   Navas, O K ^b   Ganesh, ^b   Zhang, Hengyun ^b   Kripesh, V ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

3 D package; Direct liquid cooling; Stacked MCM; Thermal performance

Indexed keywords

DIRECT LIQUID COOLING; STACKED MCM; THERMAL PERFORMANCE;

COMPUTER SIMULATION; COOLANTS; HEAT CONVECTION; HEAT FLUX; HEAT RESISTANCE; NUMERICAL METHODS; SUPERCOOLING;

MULTICHIP MODULES;

EID: 4444278709     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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