Effects of electrochemistry on surface roughness during chemical-mechanical polishing of copper

Tribology Letters

Volumn 25, Issue 1, 2007, Pages 33-41

  Kulkarni, M ^a   Baker, M ^a   Greisen, D ^a   Ng, D ^a   Griffin, R ^a   Liang, H ^a  

^a Texas A and M University   (United States)

Author keywords

Atomic force microscope; CMP; Electrochemical reactions; Friction; Wear

Indexed keywords

CHEMICAL-MECHANICAL POLISHING; ELECTROCHEMICAL REACTION;

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROCHEMISTRY; FRICTION; OXIDATION; PH EFFECTS; SURFACE ROUGHNESS; WEAR OF MATERIALS;

ELECTROLYTIC POLISHING;

ATOMIC FORCE MICROSCOPY; COPPER; ELECTROCHEMISTRY; ELECTROLYTIC POLISHING; FRICTION; OXIDATION; PH EFFECTS; SURFACE ROUGHNESS; WEAR OF MATERIALS;

EID: 33845867452     PISSN: 10238883     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11249-006-9134-4     Document Type: Article

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