Chemical mechanical planarization of copper: pH effect

Journal of Materials Science Letters

Volumn 22, Issue 22, 2003, Pages 1623-1625

  Du, T ^a   Desai, V ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COMPLEXATION; ETCHING; MORPHOLOGY; PH EFFECTS; POROSITY; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; SURFACE CHEMISTRY; SURFACES; X RAY PHOTOELECTRON SPECTROSCOPY;

MICROGRAPHS; REMOVAL RATES;

COPPER;

EID: 0242410465     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1026353028626     Document Type: Article

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