메뉴 건너뛰기




Volumn 767, Issue , 2003, Pages 111-118

Transfer wear during CU CMP

Author keywords

[No Author keywords available]

Indexed keywords

FRICTION; INTERFACES (MATERIALS); WEAR OF MATERIALS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 0242368133     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-767-f2.7     Document Type: Conference Paper
Times cited : (11)

References (20)
  • 2
    • 0032167273 scopus 로고    scopus 로고
    • In Situ Electrochemical Investigation of Tungsten Electrochemical Behavior during Chemical Mechanical Polishing
    • D. Stein, d. Hetherington, T. Guilinger, and J. Cecchi, "In Situ Electrochemical Investigation of Tungsten Electrochemical Behavior during Chemical Mechanical Polishing," J. Eletrochem. Soc., 145, p.3190 (1998).
    • (1998) J. Eletrochem. Soc. , vol.145 , pp. 3190
    • Stein, D.1    Hetherington, D.2    Guilinger, T.3    Cecchi, J.4
  • 3
    • 0033391209 scopus 로고    scopus 로고
    • Probable Roles of Abrasive Particles in W CMP
    • J. Larsen-Basse and H. Liang, "Probable Roles of Abrasive Particles in W CMP," Wear, 233-235, p.647 (1999).
    • (1999) Wear , vol.233-235 , pp. 647
    • Larsen-Basse, J.1    Liang, H.2
  • 6
    • 0242342902 scopus 로고    scopus 로고
    • Lubricating Behavior of Copper CMP
    • May, Orlando, Fl
    • H. Liang and H. Xu, "Lubricating Behavior of Copper CMP", presented at the STLE 2001 annual meeting, May, 2001, Orlando, Fl.
    • (2001) STLE 2001 Annual Meeting
    • Liang, H.1    Xu, H.2
  • 8
    • 0242279759 scopus 로고    scopus 로고
    • Anti-Lubrication Behavior of Cu CMP
    • Sept. 25-26, Santa Clara, CA, 2001
    • th Int. VMIC, Sept. 25-26, 2001, Santa Clara, CA, 2001, pp. 137-140.
    • (2001) th Int. VMIC , pp. 137-140
    • Liang, H.1    Xu, G.H.2
  • 9
    • 0036499352 scopus 로고    scopus 로고
    • Lubricating Behavior in Chemical-Mechanical Polishing of Copper
    • H. Liang and G. Xu, "Lubricating Behavior in Chemical-Mechanical Polishing of Copper," Scripta Materialia, Vol. 46, No.5, 2002, pp.343-347.
    • (2002) Scripta Materialia , vol.46 , Issue.5 , pp. 343-347
    • Liang, H.1    Hu, G.2
  • 10
  • 11
    • 0002131757 scopus 로고    scopus 로고
    • Antiwear Mechanisms of Zinc Dithiophosphate: A Chemical Hardness Approach
    • J.M. Martin, "Antiwear Mechanisms of Zinc Dithiophosphate: a Chemical Hardness Approach," Tribology Letters, Vo. 6, p.1, (1999).
    • (1999) Tribology Letters , vol.6 , pp. 1
    • Martin, J.M.1
  • 12
    • 0030710452 scopus 로고    scopus 로고
    • A Scanning Force Microscope Study of a Tribochemical System: Stress-Enhanced Dissolution
    • J.T. Dickinson, N.-S. Park, M-W. Kim, and S.C. Langford, "A Scanning Force Microscope Study of a Tribochemical System: Stress-Enhanced Dissolution," Trib. Lett. 3, p.69 (1997).
    • (1997) Trib. Lett. , vol.3 , pp. 69
    • Dickinson, J.T.1    Park, N.-S.2    Kim, M.-W.3    Langford, S.C.4
  • 14
    • 0036688622 scopus 로고    scopus 로고
    • Interfacila Transfer between Copper and Polyurethane in Chemical-Mechanical Polishing
    • H. Liang, T.L. Mogne, and J.M. Martin, "Interfacila Transfer between Copper and Polyurethane in Chemical-Mechanical Polishing." J. Electronic Matls., Vol.31, No.8, p.872 (2002).
    • (2002) J. Electronic Matls. , vol.31 , Issue.8 , pp. 872
    • Liang, H.1    Mogne, T.L.2    Martin, J.M.3
  • 15
    • 0010279007 scopus 로고    scopus 로고
    • Modeling of Polyurethane as CMP Pads
    • J. Oung, J. Lee, and H. Liang, "Modeling of Polyurethane as CMP Pads," J. of CMP, 1, 2000, pp.323-335.
    • (2000) J. of CMP , vol.1 , pp. 323-335
    • Oung, J.1    Lee, J.2    Liang, H.3
  • 17
  • 20
    • 0242342904 scopus 로고    scopus 로고
    • Paper No. IQ75-125, (SME, Detroit, Mich., 1975)
    • N.S. Eiss and J.H. Warren, Paper No. IQ75-125, (SME, Detroit, Mich., 1975).
    • Eiss, N.S.1    Warren, J.H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.