Kinetic analysis of current enhanced intermetallic growth and its effect on electromigration reliability of solder joints

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2006, Pages 250-255

  Chao, Huang Lin ^a   Chae, Seung Hyun ^a   Zhang, Xuefeng ^a   Lu, Kuan Hsun ^a   Im, Jay ^a   Ho, Paul S ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Electromigration; Flip chip technology; Lead free solder; Under bump metallization

Indexed keywords

FLIP CHIP TECHNOLOGY; LEAD FREE SOLDERS; UNDER BUMP METALLIZATION;

CIRCUIT SIMULATION; ELECTRIC CONNECTORS; ELECTROMIGRATION; GROWTH (MATERIALS); INTERMETALLICS; RELIABILITY THEORY;

SOLDERED JOINTS;

EID: 34250739883     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2006.251224     Document Type: Conference Paper

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