Processing thin silicon with ultrashort-pulsed lasers: Creating an alternative to conventional sawing techniques

ICALEO 2003 - 22nd International Congress on Applications of Laser and Electro-Optics, Congress Proceedings

Volumn , Issue , 2003, Pages

  Ostendorf, Andreas ^a   Kulik, Christian ^a   Bärsch, Niko ^a  

^a LASER ZENTRUM HANNOVER E V   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CUTTING; DEBRIS; LASER PULSES; MATERIALS HANDLING; PULSED LASERS; SILICON;

BACK-END PROCESSING; COMMON MATERIALS; IT INDUSTRY; LASER PROCESS; MATERIAL THICKNESS; MECHANICAL METHODS; PROCESSING SPEED; ULTRASHORT-PULSED LASER;

LASER MATERIALS PROCESSING;

EID: 57349158408     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2351/1.5060131     Document Type: Conference Paper

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