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Volumn , Issue , 2002, Pages 291-303
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Effect of underfill fillet configuration on flip chip package reliability
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Author keywords
[No Author keywords available]
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Indexed keywords
ACOUSTIC MICROSCOPES;
CERAMIC MATERIALS;
DELAMINATION;
FINITE ELEMENT METHOD;
FLIP CHIP DEVICES;
MATHEMATICAL MODELS;
RELIABILITY;
SEMICONDUCTOR DEVICE MANUFACTURE;
THERMAL CYCLING;
UNDERFILL FILLET;
UNDERFILL MATERIAL;
ELECTRONICS PACKAGING;
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EID: 0036395316
PISSN: 10898190
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (4)
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