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Volumn , Issue , 2002, Pages 291-303

Effect of underfill fillet configuration on flip chip package reliability

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; CERAMIC MATERIALS; DELAMINATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE; THERMAL CYCLING;

EID: 0036395316     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (4)
  • 2
    • 0032651042 scopus 로고    scopus 로고
    • Flip chip underfill flow characteristics and prediction
    • San Diego, CA
    • Fine, P., Cobb, B., and Nguyen, L., "Flip Chip Underfill Flow Characteristics and Prediction," 48th Electron. Comp. & Tech. Conf., pp. 790-796, San Diego, CA (1999).
    • (1999) 48th Electron. Comp. & Tech. Conf. , pp. 790-796
    • Fine, P.1    Cobb, B.2    Nguyen, L.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.