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Volumn , Issue , 2003, Pages 714-719
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Interfacial fracture analysis of underfill delamination and flip chip reliability optimization
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACK PROPAGATION;
DELAMINATION;
ELASTIC MODULI;
FRACTURE MECHANICS;
INTERFACES (MATERIALS);
MATHEMATICAL MODELS;
OPTIMIZATION;
PASSIVATION;
RELIABILITY;
STRAIN;
STRESS INTENSITY FACTORS;
THERMAL EXPANSION;
FLIP CHIP RELIABILITY OPTIMIZATION;
INTERFACIAL FRACTURE ANALYSIS;
FLIP CHIP DEVICES;
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EID: 0038689166
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (9)
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