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Volumn , Issue , 2003, Pages 714-719

Interfacial fracture analysis of underfill delamination and flip chip reliability optimization

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DELAMINATION; ELASTIC MODULI; FRACTURE MECHANICS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; OPTIMIZATION; PASSIVATION; RELIABILITY; STRAIN; STRESS INTENSITY FACTORS; THERMAL EXPANSION;

EID: 0038689166     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (9)
  • 1
    • 0025461953 scopus 로고
    • Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches
    • Wang J. S. and, Suo Z., "Experimental determination of interfacial toughness curves using Brazil-nut-sandwiches", 1990, Acta Met. 38, pp 1279-1290
    • (1990) Acta Met. , vol.38 , pp. 1279-1290
    • Wang, J.S.1    Suo, Z.2
  • 2
    • 0029217926 scopus 로고    scopus 로고
    • Crack initiation and growth in electronic packages
    • Ileri L and Madenci E, Crack Initiation and Growth in Electronic Packages, Proceedings, ECTC 1995, pp 729-733
    • Proceedings, ECTC 1995 , pp. 729-733
    • Ileri, L.1    Madenci, E.2
  • 4
    • 0033710315 scopus 로고    scopus 로고
    • "Numerical simulation of interfacial delamination in electronic Packaging", Packages
    • Wang B, et al, "Numerical Simulation of Interfacial Delamination in Electronic Packaging", Packages, Inter Society Conference on Thermal Phenomena 2000, pp 400-404
    • Inter Society Conference on Thermal Phenomena 2000 , pp. 400-404
    • Wang, B.1
  • 5
    • 0003511126 scopus 로고    scopus 로고
    • Low cost flip chip technologies
    • McGraw-Hill
    • Lau J, "Low Cost Flip Chip Technologies", McGraw-Hill 2000
    • (2000)
    • Lau, J.1
  • 6
    • 0029697087 scopus 로고    scopus 로고
    • Delamination cracking in encapsulated flip chips
    • Le Call C, et al, "Delamination Cracking in Encapsulated Flip Chips", ECTC 1996, pp 430-434
    • ECTC 1996 , pp. 430-434
    • Le Call, C.1
  • 9
    • 0035364799 scopus 로고    scopus 로고
    • Numerical modeling of interfacial delamination propagation in a novel peripheral array package
    • Harries R, Sitaraman, S. K., Numerical Modeling of Interfacial Delamination Propagation in a Novel Peripheral Array Package, IEEE Trans. Components and Packaging Technologies, V24, No. 2, pp 256-264
    • IEEE Trans. Components and Packaging Technologies , vol.24 , Issue.2 , pp. 256-264
    • Harries, R.1    Sitaraman, S.K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.