10-Gbps signal propagation of high-density wiring interposer using photosensitive polyimide for 3D packaging

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1294-1299

  Kikuchi, Katsuya ^a,b   Oosato, Hirotaka ^b   Ito, Sachiko ^b   Segawa, Shigemasa ^c   Nakagawa, Hiroshi ^b   Tokoro, Kazuhiko ^b   Aoyagi, Masahiro ^a,b  

^a IEEE   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c PI Research and Development Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL STRIP-LINE; EYE DIAGRAM MEASUREMENT; HIGH-DENSITY WIRING INTERPOSER; PHOTOSENSITIVE POLYIMIDE FILM;

PHOTOSENSITIVITY; PLASTIC FILMS; POLYIMIDES; SIGNAL PROCESSING; TIME DOMAIN ANALYSIS;

ELECTRIC WIRING;

EID: 33845586076     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645821     Document Type: Conference Paper

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