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Volumn 43, Issue 7 A, 2004, Pages 4141-4145

Fabrication of high-density wiring interposer for 10 GHz 3D packaging using a photosensitive multiblock copolymerized polyimide

Author keywords

3D packaging; Interposer; Photosensitive multiblock copolymerized polyimide

Indexed keywords

ELECTRIC BREAKDOWN; ELECTRIC PROPERTIES; ELECTRIC WIRING; FREQUENCIES; GOLD COMPOUNDS; MICROPROCESSOR CHIPS; PHOTOSENSITIVITY; POLYIMIDES; SCANNING ELECTRON MICROSCOPY;

EID: 4644306058     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.43.4141     Document Type: Article
Times cited : (15)

References (9)
  • 2
    • 4644289649 scopus 로고    scopus 로고
    • U. S. Patent 5502143
    • Y. Oie and H. Itatani: U. S. Patent 5502143 (1996).
    • (1996)
    • Oie, Y.1    Itatani, H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.