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Volumn 43, Issue 7 A, 2004, Pages 4141-4145
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Fabrication of high-density wiring interposer for 10 GHz 3D packaging using a photosensitive multiblock copolymerized polyimide
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Author keywords
3D packaging; Interposer; Photosensitive multiblock copolymerized polyimide
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Indexed keywords
ELECTRIC BREAKDOWN;
ELECTRIC PROPERTIES;
ELECTRIC WIRING;
FREQUENCIES;
GOLD COMPOUNDS;
MICROPROCESSOR CHIPS;
PHOTOSENSITIVITY;
POLYIMIDES;
SCANNING ELECTRON MICROSCOPY;
3D PACKAGING;
INTERPOSER;
PHOTOSENSITIVE MULTIBLOCK COPOLYMERIZED POLUIMIDE;
TIME DOMAIN REFLECTOMETRY (TDR);
COPOLYMERIZATION;
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EID: 4644306058
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/JJAP.43.4141 Document Type: Article |
Times cited : (15)
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References (9)
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