SCOPUS 정보 검색 플랫폼

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 43, Issue 7 A, 2004, Pages 4141-4145

Fabrication of high-density wiring interposer for 10 GHz 3D packaging using a photosensitive multiblock copolymerized polyimide

(8) Kikuchi, Katsuya a Segawa, Shigemasa b Jung, Eun Sil a Nemoto, Yoshihiko c Umemoto, Mitsuo c Nakagawa, Hiroshi a Tokoro, Kazuhiko a Aoyagi, Masahiro a

a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST (Japan)

b PI R and D Co Ltd (Japan)

c ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET (Japan)

Author keywords

3D packaging; Interposer; Photosensitive multiblock copolymerized polyimide

Indexed keywords

ELECTRIC BREAKDOWN; ELECTRIC PROPERTIES; ELECTRIC WIRING; FREQUENCIES; GOLD COMPOUNDS; MICROPROCESSOR CHIPS; PHOTOSENSITIVITY; POLYIMIDES; SCANNING ELECTRON MICROSCOPY;

3D PACKAGING; INTERPOSER; PHOTOSENSITIVE MULTIBLOCK COPOLYMERIZED POLUIMIDE; TIME DOMAIN REFLECTOMETRY (TDR);

COPOLYMERIZATION;

EID: 4644306058 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/JJAP.43.4141 Document Type: Article

Times cited : (15)

References (9)

1
- 4644224658
- M. Hiro and C. C. Schuckert: IEEE Trans. Adv. Packaging 9 (2000) 37.
- (2000) IEEE Trans. Adv. Packaging , vol.9 , pp. 37
- Hiro, M.¹ Schuckert, C.C.²

2
- 4644289649
- U. S. Patent 5502143
- Y. Oie and H. Itatani: U. S. Patent 5502143 (1996).
- (1996)
- Oie, Y.¹ Itatani, H.²

3
- 0035478826
- T. Fukushima, T. Oyama, T. Iijima, M. Tomoi and H. Itatani: J. Polym. Sci. A 39 (2001) 3451.
- (2001) J. Polym. Sci. A , vol.39 , pp. 3451
- Fukushima, T.¹ Oyama, T.² Iijima, T.³ Tomoi, M.⁴ Itatani, H.⁵

4
- 0034764026
- M. Aoyagi, S. Segawa, E. Jung, T. Itatani, M. Komuro, T. Sakamoto, H. Itatani, M. Miyamura and S. Matsumoto: Proc. SPIE 3454 (2001) 1073.
- (2001) Proc. SPIE , vol.3454 , pp. 1073
- Aoyagi, M.¹ Segawa, S.² Jung, E.³ Itatani, T.⁴ Komuro, M.⁵ Sakamoto, T.⁶ Itatani, H.⁷ Miyamura, M.⁸ Matsumoto, S.⁹

5
- 4644318591
- Kyoto
- K. Kikuchi, S. Segawa, E. Jung, H. Nakagawa, K. Tokoro, H. Itatani and M. Aoyagi: Proc. 6th VLSI Packaging Workshop of Japan, Kyoto, 2002, p. 43.
- (2002) Proc. 6th VLSI Packaging Workshop of Japan , pp. 43
- Kikuchi, K.¹ Segawa, S.² Jung, E.³ Nakagawa, H.⁴ Tokoro, K.⁵ Itatani, H.⁶ Aoyagi, M.⁷

6
- 84866587548
- E. Jung, S. Segawa, T. Itatani, M. Komuro, H. Itatani, M. Miyamura, S. Matsumoto and M. Aoyagi: Photopolymer Sci. Tech. 14 (2001) 61.
- (2001) Photopolymer Sci. Tech. , vol.14 , pp. 61
- Jung, E.¹ Segawa, S.² Itatani, T.³ Komuro, M.⁴ Itatani, H.⁵ Miyamura, M.⁶ Matsumoto, S.⁷ Aoyagi, M.⁸

7
- 4644371811
- France
- S. Segawa, E. Jung, H. Nakagawa, K. Tokoro, K. Kikuchi, H. Itatani and M. Aoyagi: Proc. 6th Eur. Tech. Symp. Polyimides and High Performance Functional Polymers STEPI6, France, 2002, p. 215.
- (2002) Proc. 6th Eur. Tech. Symp. Polyimides and High Performance Functional Polymers STEPI6 , pp. 215
- Segawa, S.¹ Jung, E.² Nakagawa, H.³ Tokoro, K.⁴ Kikuchi, K.⁵ Itatani, H.⁶ Aoyagi, M.⁷

8
- 0035300622
- K. Takahashi, H. Terao, Y. Tomita, Y. Yamaji, M. Hoshino, T. Sato, T. Morifuji, M. Sunohara and M. Bonkohara: Jpn. J. Appl. Phys. 40 (2001) 3032.
- (2001) Jpn. J. Appl. Phys. , vol.40 , pp. 3032
- Takahashi, K.¹ Terao, H.² Tomita, Y.³ Yamaji, Y.⁴ Hoshino, M.⁵ Sato, T.⁶ Morifuji, T.⁷ Sunohara, M.⁸ Bonkohara, M.⁹

9
- 0011346858
- UP Media Group, Atlanta
- D. A. Smolyansky and S. D. Corey: Printed Circuit Design Magazine (UP Media Group, Atlanta, 1999) p. 18.
- (1999) Printed Circuit Design Magazine , pp. 18
- Smolyansky, D.A.¹ Corey, S.D.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.