Ultra wide bandwidth performance of high-density wiring interposer for 3D packaging

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 630-634

  Kikuchi, Katsuya ^a   Segawa, Shigemasa ^b   Jung, Eun Sil ^a   Nemoto, Yoshihiko ^c   Umemoto, Mitsuo ^c   Nakagawa, Hiroshi ^a   Tokoro, Kazuhiko ^a   Aoyagi, Masahiro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b PI R and D Co Ltd   (Japan)

^c JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; ELECTRIC BREAKDOWN; ELECTRIC WIRING; PERMITTIVITY; PHOTOSENSITIVITY; POLYIMIDES;

INTERPOSERS; SIGNAL TRANSMISSION; THERMAL CURING; TIME DOMAIN REFLECTOMETRY (TDR);

ELECTRONICS PACKAGING;

EID: 10444239249     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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