Transient analysis of impact fracturing of solder joints

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 503-509

  Yen, Chang Lin ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTERMETALLICS; NUMERICAL ANALYSIS;

CONTROLLED IMPACT LOADS; FRAGMENTATION MECHANISMS; THREE-DIMENSIONAL FINITE ELEMENT ANALYSIS;

SOLDERED JOINTS;

EID: 33745726129     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502857     Document Type: Conference Paper

References (9)

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4. Date, M. et al, "Ductile-to-brittle Transition in Sn-Zn Solder Joints Measured by Impact Test," Scripta Materialia Vo. 51 (2004), pp. 641-645.
5. Yeh, C.-L. et al, "Transient Deformation and Fracturing of Solder Joints Subjected to Impact Loads," Proc IMAPS Flip Chip 2004, Austin, TX, 2004.
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