Simultaneous double side grinding of silicon wafers: a literature review

International Journal of Machine Tools and Manufacture

Volumn 46, Issue 12-13, 2006, Pages 1449-1458

  Li, Z C ^a   Pei, Z J ^a   Fisher, Graham R ^b  

^a Sunflower Networking Group   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Grinding; Machining; Modeling; Semiconductor material; Silicon wafer; Simultaneous double side grinding

Indexed keywords

GRINDING (MACHINING); INTEGRATED CIRCUITS; MACHINE DESIGN; MATHEMATICAL MODELS; SUBSTRATES;

MACHINE DEVELOPMENT; PROCESS MODELING; SIMULTANEOUS DOUBLE SIDE GRINDING (SDSG); WIRE-SAWN WAFERS;

SILICON WAFERS;

EID: 33746353107     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2005.09.011     Document Type: Article

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