Extending copper metallization technology for wiring to end-of-roadmap feature sizes

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 11-17

  Engelhardt, Manfred ^a   Schindler, G ^a   Mosig, K ^a   Steinlesberger, G ^a   Steinhogl W ^a   Gebara, G ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS SILICON; CHEMICAL MECHANICAL POLISHING; CURRENT DENSITY; DEPOSITION; ELECTRIC CONDUCTIVITY; ELECTRIC WIRE; GRAIN BOUNDARIES; METALLIZING; OPTIMIZATION; PLASMA ETCHING; POROSITY; PROCESS CONTROL; ULTRATHIN FILMS;

ELECTRICAL ISOLATION; INTERMETAL DIELECTRICS (IMD);

COPPER;

EID: 0035554951     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)