Elasticity and resistivity study on the electromigration effects observed in aluminum-silicon-copper alloy thin films

Materials Science and Engineering: A

Volumn 370, Issue 1-2, 2004, Pages 168-171

  Mizubayashi, H ^a   Kashimura, D ^a   Yokota, K ^a   Tanimoto, H ^a  

^a UNIVERSITY OF TSUKUBA   (Japan)

Author keywords

Al Si(Cu); Anelasticity; Electromigration; Grain growth; Resistivity

Indexed keywords

ACTIVATION ENERGY; ALUMINUM COPPER ALLOYS; CURRENT DENSITY; ELASTIC MODULI; ELASTICITY; ELECTRIC CONDUCTIVITY; ELECTROMIGRATION; GRAIN BOUNDARIES; GRAIN GROWTH; MEASUREMENT THEORY; THERMAL EFFECTS;

ALUMINUM-SILICON-COPPER ALLOY THIN FILMS; ANELASTICITY RESISTIVITY; ELECTROMIGRATION EFFECTS;

THIN FILMS;

ELASTICITY;

EID: 1842788139     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2002.12.006     Document Type: Article

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