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Volumn 24-25, Issue , 2005, Pages 61-64
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Elasticity study of nanostructured copper thin films
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Author keywords
Copper thin films; Grain boundary; Internal friction; Young's modulus
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Indexed keywords
COPPER THIN FILMS;
CU FILMS;
CU METALLIZATION;
ELASTIC PROPERTIES;
FILMS THINNERS;
NANOSTRUCTURED COPPERS;
TA BUFFER LAYERS;
UNDERLYING MECHANISMS;
YOUNG'S MODULUS;
ELASTIC MODULI;
ELASTIC WAVES;
ELASTICITY;
FILM GROWTH;
GRAIN BOUNDARIES;
GRAIN GROWTH;
GRAIN SIZE AND SHAPE;
INTERNAL FRICTION;
MAGNETIC FILMS;
MOLECULAR BEAM EPITAXY;
SEMICONDUCTING SILICON COMPOUNDS;
TANTALUM;
THIN FILMS;
COPPER;
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EID: 33751094218
PISSN: 14226375
EISSN: None
Source Type: Journal
DOI: 10.4028/www.scientific.net/JMNM.24-25.61 Document Type: Article |
Times cited : (6)
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References (16)
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