Effect of plasma treatment on adhesion characteristics at interfaces between underfill and substrate

International Journal of Adhesion and Adhesives

Volumn 27, Issue 3, 2007, Pages 200-206

  Noh, Bo In ^a   Seok, Chang Sung ^a   Moon, Won Chul ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Epoxy; Mechanical properties of adhesive; Plasma; Surface morphology

Indexed keywords

CONTACT ANGLE; HYDROPHILICITY; PLASMAS; SURFACES; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESION STRENGTH; CURING TEMPERATURE; UNDERFILLS;

ADHESION;

ADHESION; CONTACT ANGLE; MECHANICAL PROPERTIES;

EID: 33750997915     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2006.03.005     Document Type: Article

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