Preencapsulation cleaning methods and control for microelectronics packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1994, Pages 121-133

  Wong, C P ^a   McBride, R ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; ENCAPSULATION; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; PROTECTIVE COATINGS; RELIABILITY; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES;

3-DIMENSIONAL STRUCTURE; CHIP ENCAPSULATION; MICROELECTRONICS PACKAGING; PACKAGED IC DEVICES; RELIABILITY WITHOUT HERMETICITY;

ELECTRONICS PACKAGING;

EID: 0027961268     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)