SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 227-234

Organic contamination study for adhesion enhancement between final passivation surface and packaging molding compound

(6) Alberici, S a Dellafiore, A a Manzo, G a Santospirito, G a Villa, C M a Zanotti, L a

a STMicroelectronics (Italy)

Author keywords

Adhesion; Contact angle; Molding compound; Surface cleaning; Wettability

Indexed keywords

CONTAMINATION; DELAMINATION; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); PASSIVATION; PLASTIC ADHESIVES; SECONDARY ION MASS SPECTROMETRY; SHEET MOLDING COMPOUNDS; SILICON WAFERS; SURFACE CLEANING;

GRINDING TAPES; STRESS EFFECTS; WETTABILITY;

MICROELECTRONICS;

EID: 4544343164 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2004.07.040 Document Type: Conference Paper

Times cited : (16)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.