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Volumn 37, Issue 11, 2006, Pages 1297-1301

Convex corners undercutting and rhombus compensation in KOH with and without IPA solution on (1 1 0) silicon

Author keywords

(1 1 0) silicon; Convex corner; KOH solution; Rhombus compensation

Indexed keywords

ALCOHOLS; ETCHING; SATURATION (MATERIALS COMPOSITION); SEMICONDUCTING SILICON; SOLUTIONS;

EID: 33750617182     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.07.008     Document Type: Article
Times cited : (11)

References (16)
  • 3
    • 0042034767 scopus 로고    scopus 로고
    • Fabrication of reflective micromirror in micromechanical optical switches
    • Dong W., Chen W.Y., Yang H., et al. Fabrication of reflective micromirror in micromechanical optical switches. Proc. SPIE 4928 (2002) 103-107
    • (2002) Proc. SPIE , vol.4928 , pp. 103-107
    • Dong, W.1    Chen, W.Y.2    Yang, H.3
  • 4
    • 0033738146 scopus 로고    scopus 로고
    • Fabrication of very smooth walls and bottoms of silicon microchannels for heat dissipation of semiconductor devices
    • Dwivedi V.K., Gopal R., and Ahmad S. Fabrication of very smooth walls and bottoms of silicon microchannels for heat dissipation of semiconductor devices. Microelectron. J. 31 (2000) 405-410
    • (2000) Microelectron. J. , vol.31 , pp. 405-410
    • Dwivedi, V.K.1    Gopal, R.2    Ahmad, S.3
  • 5
    • 0032121946 scopus 로고    scopus 로고
    • Aqueous KOH etching of silicon (1 1 0) etch characteristics and compensation methods for convex corners
    • Kim B., and Cho D.Dan. Aqueous KOH etching of silicon (1 1 0) etch characteristics and compensation methods for convex corners. J. Electrochem. Soc. 145 7 (1998) 2499-2508
    • (1998) J. Electrochem. Soc. , vol.145 , Issue.7 , pp. 2499-2508
    • Kim, B.1    Cho, D.Dan.2
  • 6
    • 0343060861 scopus 로고    scopus 로고
    • Structuring of convex corners using a reoxidation process-application to a tuning fork resonator made from (1 1 0)-silicon
    • Giousouf M., Assmus F., and Kück H. Structuring of convex corners using a reoxidation process-application to a tuning fork resonator made from (1 1 0)-silicon. Sensors Actuators A 76 (1999) 416-424
    • (1999) Sensors Actuators A , vol.76 , pp. 416-424
    • Giousouf, M.1    Assmus, F.2    Kück, H.3
  • 7
    • 0031221973 scopus 로고    scopus 로고
    • New structure for corner compensation in anisotropic KOH etching
    • Enoksson P. New structure for corner compensation in anisotropic KOH etching. J. Micromech. Microeng. 7 (1997) 141-144
    • (1997) J. Micromech. Microeng. , vol.7 , pp. 141-144
    • Enoksson, P.1
  • 8
    • 33750617686 scopus 로고    scopus 로고
    • Analysis and prevention of convex corner undercutting in bulk micromachined silicon microstructures
    • Biswas K., Das S., and Kal S. Analysis and prevention of convex corner undercutting in bulk micromachined silicon microstructures. Microelectron. J. xx (2005) 1-5
    • (2005) Microelectron. J. xx , pp. 1-5
    • Biswas, K.1    Das, S.2    Kal, S.3
  • 9
    • 0030233675 scopus 로고    scopus 로고
    • A new approach to convex corner compensation for anisotropic etching of (1 0 0) Si in KOH
    • Zhang Q.X., Liu L.T., and Li Z.J. A new approach to convex corner compensation for anisotropic etching of (1 0 0) Si in KOH. Sensors Actuators A 56 (1996) 251-254
    • (1996) Sensors Actuators A , vol.56 , pp. 251-254
    • Zhang, Q.X.1    Liu, L.T.2    Li, Z.J.3
  • 10
    • 11744381925 scopus 로고
    • Etching front control of 〈1 1 0〉 strips for corner compensation
    • Bao M., Burrer Chr., Esteve J., Bausells J., and Marco S. Etching front control of 〈1 1 0〉 strips for corner compensation. Sensors Actuators A 37-38 (1993) 727-732
    • (1993) Sensors Actuators A , vol.37-38 , pp. 727-732
    • Bao, M.1    Burrer, Chr.2    Esteve, J.3    Bausells, J.4    Marco, S.5
  • 11
    • 0035279246 scopus 로고    scopus 로고
    • Convex corner undercutting of {1 0 0} silicon in anisotropic KOH etching: the new step-flow Model of 3-D structuring and first simulation results
    • Member, IEEE IEEE
    • SchrÖder H., Obermeier E., et al., Member, IEEE. Convex corner undercutting of {1 0 0} silicon in anisotropic KOH etching: the new step-flow Model of 3-D structuring and first simulation results. J. Microelectromechanical Syst. 10 1 (2001) 88-97 IEEE
    • (2001) J. Microelectromechanical Syst. , vol.10 , Issue.1 , pp. 88-97
    • SchrÖder, H.1    Obermeier, E.2
  • 12
    • 2342475191 scopus 로고    scopus 로고
    • Compensation structures for V-grooves connected to square apertures in KOH-etched (1 0 0) silicon: theory, simulation and experimentation
    • Wacogne B., Sadani Z., and Gharbi T. Compensation structures for V-grooves connected to square apertures in KOH-etched (1 0 0) silicon: theory, simulation and experimentation. Sensors Actuators A 112 (2004) 328-339
    • (2004) Sensors Actuators A , vol.112 , pp. 328-339
    • Wacogne, B.1    Sadani, Z.2    Gharbi, T.3
  • 13
    • 0034247280 scopus 로고    scopus 로고
    • Silicon anisotropic etching in alkaline solution III: on the possibility of spatial structures forming in the course of Si (1 0 0) anisotropic etching in KOH and KOH+IPA solutions
    • Zubel I. Silicon anisotropic etching in alkaline solution III: on the possibility of spatial structures forming in the course of Si (1 0 0) anisotropic etching in KOH and KOH+IPA solutions. Sensors Actuators 84 (2000) 116-125
    • (2000) Sensors Actuators , vol.84 , pp. 116-125
    • Zubel, I.1
  • 14
    • 0035128210 scopus 로고    scopus 로고
    • Silicon anisotropic etching in alkaline solutions IV: the effect of organic and inorganic agents on silicon anisotropic etching process
    • Zubel I., Barycka I., Kotowska K., and Kramkowska M. Silicon anisotropic etching in alkaline solutions IV: the effect of organic and inorganic agents on silicon anisotropic etching process. Sensors Actuators A 87 (2001) 163-171
    • (2001) Sensors Actuators A , vol.87 , pp. 163-171
    • Zubel, I.1    Barycka, I.2    Kotowska, K.3    Kramkowska, M.4
  • 15
    • 4544326228 scopus 로고    scopus 로고
    • Etch rates and morphology of silicon (h k l) surfaces etched in KOH and KOH saturated with isopropanol solutions
    • Zubel I., and Kramkowska M. Etch rates and morphology of silicon (h k l) surfaces etched in KOH and KOH saturated with isopropanol solutions. Sensors Actuators A 115 (2004) 549-556
    • (2004) Sensors Actuators A , vol.115 , pp. 549-556
    • Zubel, I.1    Kramkowska, M.2
  • 16
    • 1842430857 scopus 로고    scopus 로고
    • Mechanism for convex corner under cutting of (1 1 0) silicon in KOH
    • Dong W., Zhang X.D., Liu C.X., et al. Mechanism for convex corner under cutting of (1 1 0) silicon in KOH. Microelectron. J. 35 (2004) 417-419
    • (2004) Microelectron. J. , vol.35 , pp. 417-419
    • Dong, W.1    Zhang, X.D.2    Liu, C.X.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.