The mechanical properties of lead-tin based solders in the temperature range from-200°C to 150°C

International Journal of Microcircuits and Electronic Packaging

Volumn 20, Issue 2, 1997, Pages 150-154

  Jones, W Kinzy ^a,b,c,d   Liu, Yanqing ^a,c,e   Zampino, Marc A ^a,c   Gonzalez, Gerardo ^a,c,f,g,h  

^a The Department of Electrical and Computer Engineering   (United States)

^b MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^c FLORIDA INTERNATIONAL UNIVERSITY   (United States)

^d IMAPS ^*  (United States)

^e XI'AN JIAOTONG UNIVERSITY   (China)

^f Aptek Williams Inc   (United States)

^g Universidade Federal de Ala goas   (Brazil)

^h UNIVERSITY OF FLORIDA   (United States)

Author keywords

Elastic Modulus; Mechanical Properties; Pb Sn Solders; Plasticity; Strengthening

Indexed keywords

EID: 0006667816     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. W. K. Jones, R.W. Harshbarger, W. Jiang, and R. Zhuge, "Evaluation of Braze Process for AIN Packages," International Journal of Microelectronics, Vol. 14, No. 1, pp. 11-22, 1991.
2. R. Zhuge, W.K. Jones and S.S. Maganti, "Stress Analysis of Multilayer Multichip Module (MCM-D) Structures Using the Series Solution of Elasticity Theory," Proceedings of the International Microelectronics Symposium, ISHM, Yokohomo Japan, pp. 441-447, 1992.
3. G. L. Gonzalez, Y. Q. Liu and S. S. Maganti, "Physical Properties of Low Temperature Solders and Die Attach Materials," Proceedings of Southcon 95, Ft. Lauderdale, Florida, USA, pp. 340-344, 1995.
4. H. S. Morgan, "Thermal Stresses in Layered Electrical Assemblies Bonded with Solder," Transactions of ASME, Journal of Electronic Packaging, Vol. 113, pp. 350-354, December 1991.
5. E. I. Savage and G. D. Getzan, "Mechanical Behavior of 60Tin/40 Lead Solder at Various Strain Rates and Temperatures," Proceeding of International Symposium on Microelectronics, ISHM, Chicago, pp. 669-674, 1990.
6. M. Harada and R. Satoh, "Mechanical Characteristics of 96.5Sn/3.5Ag Solder in Microbonding," IEEE Trans. on Components, Hybrids, and Manufacturing Technology, CHMT, Vol. 13, No. 4, pp. 736-742, 1990.
7. Y. Q. Liu, W. K. Jones, M. A. Zampino, and G. L. Gonzalez, "A Study on Fracture Mechanism of Two Types of Solder at Low Temperatures," Proceedings of the Second International Symposium on Electronic Packaging Technology, ISEPT, Shanghai, China, pp. 460-465, 1996.
8. W.K. Jones, Y.Q. Liu, and G. L. Gonzalez, "At-Temperature Mechanical Properties of Lead-Tin Based Alloy," Proceedings, Emerging Microelectronics and Interconnection Technologies, ISHM, Bangalore, India, pp. 57-63, 1996.