Mechanisms for the Intermetallic Formation during the Sn-20In-2.8Ag/Ni Soldering Reactions

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 374-381

  Chuang, T H ^a   Huang, K W ^a   Lin, W H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Growth kinetics; Intermetallic slabs; Ni substrate; Sn 20In 2.8Ag; Transverse ripening

Indexed keywords

COMPOSITION; CRYSTALS; ENERGY DISPERSIVE SPECTROSCOPY; GROWTH KINETICS; HIGH TEMPERATURE EFFECTS; LEAD ALLOYS; NICKEL; SILVER; SOLDERING; SOLDERING ALLOYS; TIN;

FATIGUE RESISTANCE; INTERMETALLIC SLABS; TRANSVERSE RIPENING;

INTERMETALLICS;

EID: 2342542468     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0146-2     Document Type: Article

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